Table of Content

Chapter 1. Executive Summary: Shipbuilding Market
Chapter 2. Research Methodology & Research Framework

2.1. Research Objective
2.2. Product Overview
2.3. Market Segmentation
2.4. Qualitative Research
2.4.1. Primary & Secondary Sources
2.5. Quantitative Research
2.5.1. Primary & Secondary Sources
2.6. Breakdown of Primary Research Respondents, By Region
2.7. Assumption for Study
2.8. Market Size Estimation
2.9. Data Triangulation

Chapter 3. Shipbuilding Market Overview

3.1. Application Value Chain Analysis
3.1.1. Material Provider
3.1.2. Manufacturer
3.1.3. Distributor
3.1.4. End Users
3.2. Application Outlook
3.2.1. Overview of Shipbuilding Market
3.2.2. EXIM Data
3.3. PESTLE Analysis
3.4. Porter's Five Forces Analysis
3.4.1. Bargaining Power of Suppliers
3.4.2. Bargaining Power of Buyers
3.4.3. Threat of Substitutes
3.4.4. Threat of New Entrants
3.4.5. Degree of Competition
3.5. Market Dynamics and Trends
3.5.1. Growth Drivers
3.5.1.1. Growing Product Use in Consumer Electronics and Integrated Circuits Integration
3.5.2. Restraints
3.5.2.1. High Costs
3.5.3. Opportunity
3.5.3.1 Growing Demand for IoT, AI Integration, and Wireless Communicating Products
3.5.4. Key Trend
3.6. Market Growth and Outlook
3.6.1. Market Revenue Estimates and Forecast (US$ Mn), 2025 – 2035
3.6.2. Price Trend Analysis

Chapter 4. Competition Dashboard

4.1. Market Concentration Rate
4.2. Company Market Share Analysis (Value %), 2025
4.3. Competitor Mapping & Benchmarking

Chapter 5. Shipbuilding Market Analysis

5.1. Key Insights
5.2. Market Size and Forecast, 2026-2035 (US$ Mn)
5.2.1. By Component
5.2.1.1. Memory Devices
5.2.1.2. Logic Devices
5.2.1.3. Analog IC
5.2.1.4. MPU
5.2.1.5. MCU
5.2.1.6. Sensors
5.2.1.7. Discrete Power Devices
5.2.1.8. Others
5.2.2. By Node Size
5.2.2.1. 65nm
5.2.2.2. 45/40nm
5.2.2.3. 32/28nm
5.2.2.4. 22/20nm
5.2.2.5. 16/14nm
5.2.2.6. 10/7nm
5.2.2.7. 7/5nm
5.2.2.8. 180nm
5.2.2.9. 130nm
5.2.2.10. 90nm
5.2.2.11. 5nm
5.2.3. By Application
5.2.3.1. Telecommunication
5.2.3.2. Defense and Military
5.2.3.3. Industrial
5.2.3.4. Consumer Electronics
5.2.3.5. Automotive
5.2.3.6. Others
5.2.4. By Region
5.2.4.1. North America
5.2.4.1.1. The U.S.
5.2.4.1.2. Canada
5.2.4.1.3. Mexico
5.2.4.2. Europe
5.2.4.2.1. Western Europe
5.2.4.2.1.1. The UK
5.2.4.2.1.2. Germany
5.2.4.2.1.3. France
5.2.4.2.1.4. Italy
5.2.4.2.1.5. Spain
5.2.4.2.1.6. Rest of Western Europe
5.2.4.2.2. Eastern Europe
5.2.4.2.2.1. Poland
5.2.4.2.2.2. Russia
5.2.4.2.2.3. Rest of Eastern Europe
5.2.4.3. Asia Pacific
5.2.4.3.1. China
5.2.4.3.2. India
5.2.4.3.3. Japan
5.2.4.3.4. South Korea
5.2.4.3.5. Australia & New Zealand
5.2.4.3.6. ASEAN
5.2.4.3.7. Rest of Asia Pacific
5.2.4.4. Middle East & Africa
5.2.4.4.1. UAE
5.2.4.4.2. Saudi Arabia
5.2.4.4.3. South Africa
5.2.4.4.4. Rest of MEA
5.2.4.5. South America
5.2.4.5.1. Argentina
5.2.4.5.2. Brazil
5.2.4.5.3. Rest of South America

Chapter 6. North America Shipbuilding Market Analysis

6.1. Market Dynamics and Trends
6.1.1. Growth Drivers
6.1.2. Restraints
6.1.3. Opportunity
6.1.4. Key Trends
6.2. Market Size and Forecast, 2026-2035 (US$ Mn)
6.2.1. By Component
6.2.2. By Node Size
6.2.3. By Application
6.2.3. By Region

Chapter 7. Europe Shipbuilding Market Analysis

7.1. Market Dynamics and Trends
7.1.1. Growth Drivers
7.1.2. Restraints
7.1.3. Opportunity
7.1.4. Key Trends
7.2. Market Size and Forecast, 2026-2035 (US$ Mn)
7.2.1. By Component
7.2.2. By Node Size
7.2.3. By Application
7.2.3. By Region

Chapter 8. Asia Pacific Shipbuilding Market Analysis

8.1. Market Dynamics and Trends
8.1.1. Growth Drivers
8.1.2. Restraints
8.1.3. Opportunity
8.1.4. Key Trends
8.2. Market Size and Forecast, 2026-2035 (US$ Mn)
8.2.1. By Component
8.2.2. By Node Size
8.2.3. By Application
8.2.3. By Region

Chapter 9. Middle East & Africa Shipbuilding Market Analysis

9.1. Market Dynamics and Trends
9.1.1. Growth Drivers
9.1.2. Restraints
9.1.3. Opportunity
9.1.4. Key Trends
9.2. Market Size and Forecast, 2026-2035 (US$ Mn)
9.2.1. By Component
9.2.2. By Node Size
9.2.3. By Application
9.2.3. By Region

Chapter 10. South America Shipbuilding Market Analysis

10.1. Market Dynamics and Trends
10.1.1. Growth Drivers
10.1.2. Restraints
10.1.3. Opportunity
10.1.4. Key Trends
10.2. Market Size and Forecast, 2026-2035 (US$ Mn)
10.2.1. By Component
10.2.2. By Node Size
10.2.3. By Application
10.2.3. By Region

Chapter 11. Company Profile (Company Overview, Financial Matrix, Key Product landscape, Key Personnel, Key Competitors, Contact Address, and Business Strategy Outlook)

11.1. TOSHIBA Corporation
11.2. MediaTek Inc
11.3. Intel Corporation
11.4. NXP Semiconductors
11.5. QUALCOMM Incorporated
11.6. NVIDIA Corporation
11.7. Advanced Micro Devices, Inc.
11.8. Micron Technology Inc.
11.9. SK Hynix Inc.
11.10. Broadcom Inc.
11.11. STMicroelectronics
11.12. Taiwan Semiconductors
11.13. Samsung Electronics Co Ltd
11.14. Maxim Integrated Products Inc.
11.15. Analog Devices Inc.
11.16. Texas Instruments Inc.
11.16. Infineon Technologies
11.16. Others

Chapter 12. Annexure

12.1. List of Secondary Sources
12.2. Macro Economic Outlook/Indicators